A kinematical Dislocation Based Model and Admissible Velocity Field for rediction of Nanostructural Changes and Mechanical Properties of Al-Cu-Al Laminated Composite During ECAE Process

Tolami, Bhzad; Karimi Taheri, Ali; Shahmiri, Mohamad; Arabi, Hosin

doi:10.22067/ma.v22i1.10815

A kinematical Dislocation Based Model and Admissible Velocity Field for rediction of Nanostructural Changes and Mechanical Properties of Al-Cu-Al Laminated Composite During ECAE Process

Document Type : Original Articles

Authors

bhzad tolami

Ali karimi taheri

mohamad Shahmiri

hosin arabi

10.22067/ma.v22i1.10815

Abstract

In this research, a mathematical model based on Bezier equations was developed in order to predict the admissible velocity field during the deformation of the aluminum-copper-aluminum laminated composite in a plane strain equal channel angular extrusion (ECAE) process. The strain and strain rate fields were evaluated using the fixed Taylor factor based on the proposed streamline and the modified ETMB microstructural model for the nanostructural changes in aluminum-copper layers. The results showed that the size of the dislocation cells formed in copper layer was smaller than that of the Al layer, especially when the aluminum layer was located adjacent to the outer corner angle and when a lower die angle was used. Furthermore, the results predicted by the model regarding the different passes of ECAE process were in good agreement with the results obtained from the microstructural and textural examinations performed using TEM and EBSD techniques.

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